Характеристики
Описание товара
high precision 0.02mm/0.01mm Polyurethane Enameled Fingerprint Fly Copper Line Soldering motherboard BGA CPU bga ic chip repair
1. Adopting non-copper imported materials, Germany's advanced RUI-SRO winding technology, featuring high efficiency, high anti-interference, low inductance and superplastic extension.
2, using environmentally friendly vacuum bag packaging with desiccant
3, the scope of application: Apple motherboard fingerprint chip, micro earphone cable, voice coil, electronic watch, special inductor wire, etc.