Multi-purpose BGA Reballing Stencil Kit for Phone 6 6P 6S 6SP 7 7P IC Chip CPU Solder Tin Plant Net 0.12mm Thickness | Инструменты

Multi-purpose BGA Reballing Stencil Kit for Phone 6 6P 6S 6SP 7 7P IC Chip CPU Solder Tin Plant Net 0.12mm Thickness |

Multi-purpose BGA Reballing Stencil Kit for iPhone 6 6P 6S 6SP 7 7P IC Chip CPU Solder Tin Plant Net 0.12mm Thickness

Feature:

1.0.12mm thickness 2.Imported Japan Steel 3.Anti-drum design

Dear Customer :

Thank you very much for your visiting our store!Our product 100% from orgainal factory if you have any questions,Please feel free to contact with us, best service will be provided, Please do not open dispute or leave negative feedback directly, many thanks !

About Shipping:

1.We can send out quickly since we have inventory,Normally we can send out your product in 2 working days 2.For some country, the shipping cost maybe very high, you can buy in bulk so save you some shipping cost 3.If we found your place in remote area in logistic system, we will check with you to find a best way to save your cost 4.Please kindly note our product price are not including the custom duties and remote delivery costs.if you have any requirement, please contact me before shipping.

After-sales Policy:

If the product does not match the description, we will 100% refund, please ensure the product in original status We will provide video technical support, Online support if you need

Brand Story

WeTradeTek a professional team for phone repair tools, accessories,machine etc.we have been this field for more than 5 years, if you have any other questions, welcome for inquiry , hope you have a joyful shipping !